How To Use LED

Cleaning------

Don't use unspecified chemical liquid because it may cause cracks or haze on the surface of lens. Use Alcohol, Freon TE or Chlorosen to clean LED at room temperature for less than 1minutes.

Forming------

If forming is required, it must be done before soldering. Form pin leads to be secured under 4mm from body and bedding with radio pliers or the equivalent to avoid pressure on resin. When the LED is mounted into a P.C.board, pitch spacing should be aligned to prevent cause any stress to the resin. Any unsuitable stress applied to resin may break bonding wire in LED, which will cause failure.

Soldering------

The soldering specification is 260C for 5 seconds, soldering iron should be operated under 30W (dip LED up to 4mm from body). Don't apply any force or mechanical stress onto the leads or epoxy body during soldering head is remained. Don't soldering both the leads of LED at the same time. Hold pin leads with metal tweezers during soldering to prevent heat transfer to the dice, especially for the mini Leads.

Preventing OverCurrent------

Apply overcurrent may cause LED failure or reduce life and brightness. Put protective resistor in series, not only prevent overcurrent, but also keep LED in uniform brightness. Resistor value can be determined by the formula:

Brightness------

For the purpose of obtaining uniform brightness, LED shall be kept at the same current but not voltage. It is useful for uniform bright if use larger source voltage and protective resistor. Use on forward current 20mA to obtain the most uniform brightness on yellow and green LEDs.

* NOTE: CHECK AT A DISTANCE OF 30cm FROM THE LED TO THE EYE DEFECTS *

ESD protection------

(1) Keep all common plastics such as Styrofoam molded containers, packaging "popcorn balls", vinyl and teflon containers and plastic wrap away from LED components and PC board assemblies.
(2) Have all operators that handle LED components wear wrist ground straps, that are in fact touching their skin and securely grounded through a 250 K ohm resistor.

(3) Operators should wear only cotton clothing. Clothing made of synthetic fabrics, such as nylons, polyesters and acrylics, quickly build up a very large static charge with normal body movement.

(4) Use only tables and benches that are covered with ESD protective pads, having a surface insulation resistance of 1012 ohms per square. The high surface resistance permits the static charge to bleed off very slowly at an energy level sufficiently low enough to prevent any damage to an LED component.

(5) Ground all metal work bench frames and other equipment through a 250 k ohm current limiting resistor to prevent the rapid bleed-off of electric charge.

(6) Store LED components and PC board assemblies only in ESD protective packaging and use that packaging for transporting from one location to another. Plastic ESD protective containers are made from surfactant impregnated resins, such as polyethylene. The impregnated surfactants maintain a microscopic film of moisture on the surface of the plastic which prevents the build up of any static charge.
(7) Never apply adhesive tape or an adhesive label to a PC board assembly for temporary identification through the assembly process. The turboelectric charge that is created, when it is removed prior to shipment may damage the LED components.
(8) Continually train and remind operators and other personnel of the rules and procedures to be followed to protect LED components and PC board assemblies from ESD damage.